BONSEYES: Platform for Open Development of Systems of Artificial IntelligenceShow others and affiliations
2017 (English)Conference paper, Published paper (Refereed)
Abstract [en]
The Bonseyes EU H2020 collaborative project aims to develop a platform consisting of a Data Marketplace, a Deep Learning Toolbox, and Developer Reference Platforms for organizations wanting to adopt Artificial Intelligence. The project will be focused on using artificial intelligence in low power Internet of Things (IoT) devices ("edge computing"), embedded computing systems, and data center servers ("cloud computing"). It will bring about orders of magnitude improvements in efficiency, performance, reliability, security, and productivity in the design and programming of systems of artificial intelligence that incorporate Smart Cyber-Physical Systems (CPS). In addition, it will solve a causality problem for organizations who lack access to Data and Models. Its open software architecture will facilitate adoption of the whole concept on a wider scale. To evaluate the effectiveness, technical feasibility, and to quantify the real-world improvements in efficiency, security, performance, effort and cost of adding AI to products and services using the Bonseyes platform, four complementary demonstrators will be built. Bonseyes platform capabilities are aimed at being aligned with the European FI-PPP activities and take advantage of its flagship project FIWARE. This paper provides a description of the project motivation, goals and preliminary work.
Place, publisher, year, edition, pages
ACM Digital Library, 2017.
Keywords [en]
Artificial Intelligence, Data Marketplace, Cloud computing
National Category
Computer Systems
Identifiers
URN: urn:nbn:se:bth-15781DOI: 10.1145/3075564.3076259ISI: 000626242600041ISBN: 978-1-4503-4487-6 (print)OAI: oai:DiVA.org:bth-15781DiVA, id: diva2:1175421
Conference
ACM International Conference on Computing Frontiers 2017
Projects
www.bonseyes.com
Funder
EU, Horizon 2020, 732204
Note
Invited paper
2018-01-172018-01-172022-01-18Bibliographically approved