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Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
Blekinge Institute of Technology, Faculty of Engineering, Department of Mechanical Engineering.
2014 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
Place, publisher, year, edition, pages
2014. , 45 p.
Keyword [en]
Area array flip chip, Gold bump joint, Thermal mismatch, Thermo mechanical failure
National Category
Other Mechanical Engineering
Identifiers
URN: urn:nbn:se:bth-10918OAI: oai:DiVA.org:bth-10918DiVA: diva2:867215
Subject / course
MT2517 Master's Thesis (120 credits) in Mechanical Engineering with emphasis on Structural Engineering
Educational program
MTAMT Master of Science Programme in Mechanical Engineering with emphasis on Structural Mechanics
Supervisors
Examiners
Available from: 2015-11-05 Created: 2015-11-04 Last updated: 2015-11-05Bibliographically approved

Open Access in DiVA

BTH2015Panah(1024 kB)226 downloads
File information
File name FULLTEXT02.pdfFile size 1024 kBChecksum SHA-512
9961da7395f9d81f008741a2fa3bfc72149eb40bde7c2b68a988522ddb4298179506ccdd876bd94a8267dfacf4857b98879da7019f54c9b18da29338f0e32ecc
Type fulltextMimetype application/pdf

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Mohammadi Panah, Mahshid
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Total: 226 downloads
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Total: 93 hits
CiteExportLink to record
Permanent link

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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
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  • Other locale
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Output format
  • html
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